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  • Micro-porous
  • Decorative Plating
  • Cu/Ni/Cr Plating
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  • TOP DuNC MP(MP-31)

    • Powders can be co-deposited uniformly in low current density, bottom areas of substrates
      Can reduce the consumption amount of powders
      Realize beautiful appearances and high corrosion resistance together
    • Nickel Plating Additive For Micro-porous Chromium Plating
    • ABS, PC/ABS, General metal, Nonconductor
  • TOP DuNC POWDER FS

    • Can co-deposit insoluble ultra-fine patrticles
      Can obtain beautiful appearances regardless of co-deposition rate
      Prevent cloudy appearances, high corrosion resistance
      Can deposit at low-current density, dent areas uniformly
      Prevent blushing and burnt deposition in Cr plating steps
      Not damaging to black-color trivalent Cr plating color tones
    • Nickel Plating Additive For Micro-porous Chromium Plating
    • ABS, PC/ABS, General metal